Automatic Wafer Laser Marking Machine

Automatic Wafer Laser Marking Machine
  • Degree of automation: Automatic loading and unloading,Automatic boundary positioning,Automatic engraving a code
  • Processing for wafer diameter: 4 inch,5 inch,6 inch;Customized
  • Marking content: Cross positioning mark,ID serial number
  • Scanning speed: ≤7000mm/s
  • Marking efficiency: >80pcs/hr
  • Orientation accuracy : ±2.5um
  • Repeated Accuracy : ±1um
  • Rotary accuracy: 30 arc-sec(0.08°)
  • Marking scope: X:200mm Y:150mm θ:360° Z:25mm
  • Laser wave length: 1064nm
  • Laser power: 20W@30kH
  • Product Detail

    Tech Specs

    Features

    Applications

    1) High peak power but much less thermal effect;

    2) Good beam Stability;

    3) Long life with no maintenace;

    4) Able to process multidimensional workpieces.

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  • Laser type

    Ultraviolet laser (UV laser)

     Beam quality

    ≥90%

     Laser power

    3W / 5W / 8W / 10W

     Laser wavelength

    355nm

     Working material

    ND:YVO4

     Beam mode

    TEM00(≤1.2)

     Working area

    70mm×70mm/100mm×100mm/150mm×150mm (Optional)

     Max marking speed

    ≤7000mm/s

     Min line width

    0.01mm

     Min spot diameter

    15um

     Beam divergence

    Mrad<2

     Min character

    0.15mm

     Beam stability

    Rms≤3%

     Repeat accuracy

    ±0.003mm

     Pulse frequency

    20KHz-200KHz

     Electricity demand

    220v/50Hz/10A

     Cooling system

    Air cooling

    ◆Micro-meter or nanometer level super-fining processing;

    ◆ Widespread applications: high absorption rate by various materials;

    ◆ Dust-proof sealed laser cavity without condensation;

    ◆ Much less power consumption: occupy traditional consumption of one-tenth;

    ◆ High-speed: the speed is three to five times faster than traditonal machine;

    Main used for all kinds of glass, TFT, LCD, plasma screens, textiles, thin ceramic, Silicon, IC Crystal, Sapphire, polymers, food, drug, cosmetic, polymer materials such as wire, bottles (boxes) surface marking, and micro-holes.

     

    Samples show

    automatic wafer marking machine

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