Automatic wafer laser scribing machine

Automatic wafer laser scribing machine
  • Degree of automation: Automatic loading and unloading,Automatic identifying and positioning,Automatic scribing
  • Processing for wafer diameter: 4 inch,5 inch,6 inch;Customized
  • Grain Size: Quadrilateral,Hexagon
  • Kerf width: ≤30um
  • Scribing depth: 50%~75%(≤300um)
  • Scribing speed: ≥60mm/s
  • Orientation accuracy: ±2.5um
  • Repeated accuracy : ±1um
  • Rotary accuracy: 20 arc-sec(0.06°)
  • Laser wave length: 355nm / 1064nm
  • Laser power: 10W@100kH / 20W@30kH
  • Product Detail

    Tech Specs

    Features

    Applications

    LED laser .jpg

    It’s high-end precision processing equipment to cut LED Sapphire and sapphire substrate epitaxial wafer .

    1) Operation : Full automatic

    2) Focus length automatic adjustable ;

    3) Anti-coarsening visual system ;

    4) Self-correction , barcode reading , production data statistics .

     

    LED’s Application:

    @Display backlight

    @Car

    @ Business decorative landscape lighting road lights

    @ Home decorative lighting products

    @System controller:LED screen,LED outer

     

    Character:

    1.One-button operation, fully automatic operation

    2.High-precision linear motion platform(imported)

     

    uv laser cutting machine.jpg
    3.Marble working table
    4.Adjust Focal length automatically
    5.CCD Auto-image identify & positioning system, face & back cutting

     

    6.Anti-coarsening visual system
    7.Identify Software template automatically, angle correction, auto seek& correct contour

     

    8.High reliability, low maintenance&operating cost
    9.Software correct automatically,bar code read, product data record

     

    uv laser cutting machine --software.jpg

     

    LED Sapphire UV laser scribing

    Type

    UV laser cutting

    Cutting size

    2”,4”

    Laser type

    Semicon solid laser Adjust Q

    Laser wavelenght

    355nm

    System

    X-Y repeated precision

    ≤±0.5um

    X-Y repeated Positioning

    ≤±1um

    Q axis

    15 arc-sec

    Range travel

    X-Y axis

    200mm

    Z axis

    20mm

    Cutting depth

    20-30um

    Cutting speed

    80-130mm/s

    Cutting linear width

    8um

    Ambient temperature

    20-25C

    Relative humidity

    20%-60%

    air compression

    0.5-0.8mpa

    Power

    220V/15A/50-60HZ

    Machine size

    1200*1100*1600mm

    Machine Weight

    1000KG

    level of automation

    Automatic Fully

    Control System

    PC control

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  • Type

    UV laser cutting

    Cutting size

    2”,4”

    Laser type

    Semicon solid laser Adjust Q

    Laser wavelenght

    355nm

    System

    X-Y repeated precision

    ≤±0.5um

    X-Y repeated Positioning

    ≤±1um

    Q axis

    15 arc-sec

    Range travel

    X-Y axis

    200mm

    Z axis

    20mm

     Processing

    Cutting depth

    20-30um

    Cutting speed

    80-130mm/s

    Cutting linear width

    8um

     Condition

    Ambient temperature

    20-25C

    Relative humidity

    20%-60%

    Air compression

    0.5-0.8mpa

    Power

    220V/15A/50-60HZ

    Machine size

    1200*1100*1600mm

    Machine Weight

    1000KG

    Level of automation

    Automatic Fully

    Control System

    PC control

    ◆ One-button operation, fully automatic operation;

    ◆ High-precision linear motion platform ( imported );

    ◆ Marble working table;

    ◆Identify Software template automatically, angle correction, auto seek& correct contour;

    ◆ High reliability, low maintenance & operating cost;

    ◆ Software correct automatically,bar code read, product data record.

    Laser cut , scribe GaN/Sapphire substrates and epitaxial wafers
    SiC substrates and epitaxial wafers with tiny curf and high speed .

     

    Samples show

    automatic wafer laser scribing machine

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